Applicable PCB | Applicable manufacturing process | Post reflow, pre reflow, Post solder paste printing |
PCB size | 50*50mm~350*400mm | |
PCB thickness | +/-3mm ( for bending) | |
PCB clear height | up:≤30mm;down:≤40mm | |
Inspection Items | Post reflow | Component missing, excessive component, solder ball, 0solder
misalignment, edge-on, tombstone、mounting side down、wrong
polarity、wrong component, bad component, solder bridging, cold
soldering, solder unavailability, insufficient solder, excessive
solder, component up, IC pin up, IC pin bent |
Inspection Items | Before Reflow Oven | Component missing, excessive component, component misalignment,
edge-on, mounting upside down, wrong polarity, wrong component, bad
component, solder bridging, foreign material |
After solder paste printing | Solder paste unavailability, insufficient solder paste, excessive
solder paste, solder paste misalignment, solder paste bridging,
foreign material, scratch, etc. | |
Vision System | Image pickup system | Color CCD |
Illuminating system | Four-color LED ring light source | |
Resolution | 10m, 15m, 20m optional | |
Inspection principle | Color calculation, color extraction, grey-scale calculation, image
contrast | |
Mechanic System | X/Y driving system | AC servo motor + precise ball lead-screw |
Splint method | Bilateral Automated Fixture | |
Positioning accuracy | 8m | |
Moving speed | 700mm/s(Max) | |
Track adjustment | Automatic/Manual | |
Software System | Operating system | Windows XP |
Language | English & Chinese optional | |
Output | Substrate ID, substrate names, element name, name of defects,
defect pictures, etc | |
Optional accessories | Offline programming system, SPC system, Barcode identification
system, etc | |
Power supply | AC 220V ±10%, 50/60Hz, 1KW | |
Temperature range | -10-40℃ | |
Ambient temperature | -10-85%RH(frost free) | |
Dimensions | 1450×1260×1480mm | |
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